Chaque semaine NAE vous propose une veille technologique sur une thématique de sa feuille de route technologique.
Aujourd’hui retrouvez sa veille sur la thématique Fiabilité qui abordera :
- Littelfuse – SiC Schottky diodes ideal for enhancing efficiency, reliability and thermal management – Electropages
Source : www.electropages.com – 2019-03-25
Lire la suite - What Are the Benefits of Silicon Carbide in Semiconductors? – EuroScientist
Source : www.euroscientist.com – 2019-03-25
Lire la suite - 650V SiC Schottky diodes in new package sizes reach 40A
Source : www.eenewspower.com – 2019-03-22
Lire la suite - Heat-resistant packaging technology for wide bandgap power devices and thermal reliability testing
Source : ieeexplore.ieee.org – 2019-03-20
Lire la suite - Development of SiC Chip Based Power Package for High Power and High Performance Application
Source : ieeexplore.ieee.org – 2019-03-20
Lire la suite - A nearly-perfect Ag joints prepared by novel Ag to Ag direct bonding
Source : ieeexplore.ieee.org – 2019-03-20
Lire la suite - TI isolated gate drivers integrated sensing for IGBTs and SiC MOSFETs
Source : www.electronicsweekly.com – 2019-03-18
Lire la suite - Compact SiC MOSFETs for automotive, energy, data center applications
Source : www.eenewsautomotive.com – 2019-03-18
Lire la suite - DC/DC transformers for gate drivers provide isolation up to 1200V
Source : www.smart2zero.com – 2019-03-07
Lire la suite